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SISA12ADN View Datasheet(PDF) - Vishay Semiconductors

Part Name
Description
Manufacturer
SISA12ADN
Vishay
Vishay Semiconductors Vishay
SISA12ADN Datasheet PDF : 13 Pages
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New Product
N-Channel 30 V (D-S) MOSFET
SiSA12ADN
Vishay Siliconix
PRODUCT SUMMARY
VDS (V)
RDS(on) () (Max.)
0.0043 at VGS = 10 V
30
0.0060 at VGS = 4.5 V
ID (A)a, g
25
25
Qg (Typ.)
13.6 nC
PowerPAK® 1212-8
3.3 mm
D
8
D
7
D
6
D
5
S
1
S
3.3 mm
2
S
3
G
4
Bottom View
Ordering Information:
SiSA12ADN-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET® Gen IV Power MOSFET
• 100 % Rg and UIS Tested
Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
Switch Mode Power Supplies
D
• Personal Computers and Servers
• Telecom Bricks
• VRM’s and POL
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
30
V
VGS
+ 20, - 16
TC = 25 °C
25g
Continuous Drain Current (TJ = 150 °C)
TC = 70 °C
TA = 25 °C
ID
25g
22b, c
Pulsed Drain Current (t = 300 µs)
TA = 70 °C
18b, c
A
IDM
80
Continuous Source-Drain Diode Current
TC = 25 °C
TA = 25 °C
IS
23g
2.9b, c
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L =0.1 mH
IAS
15
EAS
11
mJ
TC = 25 °C
28
Maximum Power Dissipation
TC = 70 °C
TA = 25 °C
PD
18
3.5b, c
W
TA = 70 °C
2.2b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
TJ, Tstg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambientb, f
Maximum Junction-to-Case (Drain)
t 10 s
RthJA
29
Steady State
RthJC
3.6
36
°C/W
4.5
Notes:
a. Based on TC = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 81 °C/W.
g. Package limited.
Document Number: 63234
For technical questions, contact: pmostechsupport@vishay.com
www.vishay.com
S13-0113-Rev. A, 21-Jan-13
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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