CMF-SDP10(2008) View Datasheet(PDF) - Bourns, Inc
Part Name
Description
Manufacturer
CMF-SDP10 Datasheet PDF : 3 Pages
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CMF-SDP Series - Telecom CPTC Resettable Fuses
Solder Reflow Recommendations
300
Preheating
Soldering
250
200
150
100
50
0
160–220
10–20
Product Dimensions
Time (seconds)
CMF-SDP07, 10, 25, 35, 50 & 75
Cooling
120
11.5
(.453)
MAX.
Solder reflow
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the
board.
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If reflow temperatures exceed the recommended profile, devices may not
meet the performance specifications.
Rework
• A device should not be reworked.
CMF-SDP10A, 25A, 35A & 50A
8.75
(.344)
MAX.
10.2
(402)
MAX.
9.0
(.354)
MAX.
2.6
(.102)
5.0
(.197)
11.0
(.433)
MAX.
Recommended Pad Layout
9.0
(.354)
11.0
(.433)
7.6
(.299)
5.0
(.197)
10.0
(.394)
3.2
(.126)
2.6
2.0 (.102)
(.079)
DIMENSIONS = MM
(INCHES)
Packaging options: TAPE & REEL: 350 pcs. per reel
2.4
(.094)
3.9
(.154)
0.5
(.020)
2 PLCS.
Recommended Pad Layout
MAX.
8.75
(.344)
7.2
(.283)
MAX.
7.2
(.283)
MAX.
6.3
(.248)
3.9
(.154)
3.2
8.2 (.126)
(.323)
2.4
(.094)
2.0
(.079)
Packaging options: TAPE & REEL: 400 pcs. per reel
CMF-SDP SERIES, REV. C, 11/08
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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