HSB-D4-13DC016X View Datasheet(PDF) - Amphenol Aerospace
Part Name
Description
Manufacturer
HSB-D4-13DC016X Datasheet PDF : 13 Pages
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Amphenol® High Density & High Speed
HSB3 Daughter Board Connector
DIMENSIONAL DRAWING & HOW TO ORDER
AmpAheeronspoacle
HSB3 HIGH SPEED DAUGHTER BOARD - HOW TO ORDER
Mates with:
• High Speed Mother Board
1.
2.
3.
4.
5.
Number of
Differential Pairs
Differential
Signals
Brush Wire
Plating
Termination
HSB-D4
–03
D
M
02
6.
Contact Termination
Finish
2
7.
Less Hardware
(Purchased separately see pg
10 for hardware options)
X
1. Connector Type
HSB-D4
Designates High Speed HSB3 Daughter Board
2. Number of Contacts
Number
Diff Pairs
03
05
07
10
13
No. Low
Speed
Signals
20
30
40
60
80
Dimension
A
1.375
1.725
2.075
2.775
3.475
Dimension
D
1.075
1.425
1.775
2.475
3.175
PIN 1
ORGANIZER
(TO AID IN PIN
ALIGNMENT)
.540
.325
.086 MIN. DIA.
THRU HOLE
(USE NO. 2 SCREW)
DA
3. Differential Signals
D Standard
4. Brush Wire Plating
M 0.000050 Au Min. thick over Nickel
C 0.000020 Au Min. thick over Nickel
5. Termination
Type
Stickout
(Dim. E)
01 PCB, Right Angle, .016 Dia
02 PCB, Right Angle, .016 Dia
03 PCB, Right Angle, .016 Dia
04 PCB, Right Angle, .016 Dia
06 PCB, Right Angle, .016 Dia
0.090
0.120
0.150
0.180
0.300
E ±.020
TYP
EMPTY
CAVITIES
.350
CONNECTOR
MOUNTING
SURFACE
E
±.020 TYP
.350
.410
.470
.530
6. Contact Termination Finish
Gold plated in accordance with
2
MIL-G-45204, Type II, .000030 Min.
thick Gold over .000050 Min. thick
Nickel
Tin plated in accordance with
5
ASTM B545, .00010 Min. thick
Matte Tin over .00010 Min. thick
Nickel
Tin-Lead plated in accordance with
6
SAE-AMS-P-81728, .00010 Min.
thick Tin-Lead over .00010 Min.
thick Copper
7. Hardware
X Less Hardware
Hardware is purchased
separately (see page 59 for
hardware options).
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com 55
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