LPC4357FET256 View Datasheet(PDF) - NXP Semiconductors.

Part Name

Description

Manufacturer

LPC4357FET256

32-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, LCD, EMC

NXP Semiconductors. 

NXP Semiconductors

LPC435x/3x/2x/1x

32-bit ARM Cortex-M4/M0 microcontroller

4. Ordering information

Table 1. Ordering information

Type number

Package

Name

Description

LPC4357FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm

LPC4357JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm

LPC4357JBD208 LQFP208 Plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm

LPC4353FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm

LPC4353JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm

LPC4353JBD208 LQFP208 Plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm

LPC4337FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm

LPC4337JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm

LPC4337JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

LPC4337JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm

LPC4333FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm

LPC4333JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm

LPC4333JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

LPC4333JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm

LPC4327JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

LPC4327JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm

LPC4325JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

LPC4325JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm

LPC4323JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

LPC4323JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm

LPC4322JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

LPC4322JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm

LPC4317JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

LPC4317JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm

LPC4315JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

LPC4315JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm

LPC4313JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

LPC4313JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm

LPC4312JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

LPC4312JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm

Version

SOT740-2

SOT740-2

SOT459-1

SOT740-2

SOT740-2

SOT459-1

SOT740-2

SOT740-2

SOT486-1

SOT926-1

SOT740-2

SOT740-2

SOT486-1

SOT926-1

SOT486-1

SOT926-1

SOT486-1

SOT926-1

SOT486-1

SOT926-1

SOT486-1

SOT926-1

SOT486-1

SOT926-1

SOT486-1

SOT926-1

SOT486-1

SOT926-1

SOT486-1

SOT926-1

LPC435X_3X_2X_1X

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 5.2 — 26 November 2015

© NXP Semiconductors N.V. 2015. All rights reserved.

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