STM32F031x4 STM32F031x6
Package information
7.5
WLCSP25 package information
WLCSP25 is a 25-ball, 2.423 x 2.325 mm, 0.4 mm pitch wafer level chip scale package.
Figure 43. WLCSP25 package outline
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Table 65. WLCSP25 package mechanical data
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
A
A1
A2
A3(2)
b(3) (4)
D
E
e
e1
e2
F
G
0.525
-
-
-
0.220
2.388
2.29
-
-
-
-
-
0.555
0.175
0.380
0.025
0.250
2.423
2.325
0.400
1.600
1.600
0.4115
0.3625
0.585
-
-
-
0.280
2.458
2.36
-
-
-
-
-
0.0207
-
-
-
0.0087
0.0940
0.0902
-
-
-
-
-
0.0219
0.0069
0.0150
0.0010
0.0098
0.0954
0.0915
0.0157
0.0630
0.0630
0.0162
0.0143
0.0230
-
-
-
0.0110
0.0968
0.0929
-
-
-
-
-
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