STM32F031C4Y6 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STM32F031C4Y6
STMicroelectronics
STM32F031C4Y6 Datasheet PDF : 106 Pages
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STM32F031x4 STM32F031x6
Electrical characteristics
6.3
Operating conditions
6.3.1
General operating conditions
Table 18. General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
fPCLK
VDD
VDDA
VBAT
VIN
PD
TA
TJ
Internal AHB clock frequency
-
Internal APB clock frequency
-
Standard operating voltage
-
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
Must have a potential equal
to or higher than VDD
Backup operating voltage
-
TC and RST I/O
I/O input voltage
TTa I/O
FT and FTf I/O
BOOT0
LQFP48
Power dissipation at TA = 85 °C
for suffix 6
suffix 7(2)
or
TA
=
105
°C
for
UFQFPN32
LQFP32
UFQFPN28
WLCSP25
TSSOP20
Ambient temperature for the
suffix 6 version
Maximum power dissipation
Low power dissipation(3)
Ambient temperature for the
suffix 7 version
Maximum power dissipation
Low power dissipation(3)
Junction temperature range
Suffix 6 version
Suffix 7 version
0
0
2.0
VDD
2.4
1.65
–0.3
–0.3
–0.3
0
-
-
-
-
-
-
–40
–40
–40
–40
–40
–40
48
48
3.6
3.6
3.6
3.6
VDDIOx+0.3
VDDA+0.3(1)
5.5(1)
5.5
364
526
357
169
267
182
85
105
105
125
105
125
MHz
V
V
V
V
mW
°C
°C
°C
1. For operation with a voltage higher than VDDIOx + 0.3 V, the internal pull-up resistor must be disabled.
2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax. See Section 7.7: Thermal characteristics.
3.
In low power dissipation state,
Thermal characteristics).
TA
can
be
extended
to
this
range
as
long
as
TJ
does
not
exceed
TJmax
(see
Section
7.7:
6.3.2
Operating conditions at power-up / power-down
The parameters given in Table 19 are derived from tests performed under the ambient
temperature condition summarized in Table 18.
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