MC100LVE222(2000) View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
MC100LVE222 Datasheet PDF : 8 Pages
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MC100LVE222
PACKAGE DIMENSIONS
4X
0.20 (0.008) H L鈥揗 N
FA SUFFIX
TQFP PACKAGE
CASE 848D鈥03
ISSUE C
4X TIPS
0.20 (0.008) T L鈥揗 N
52
1
鈥揕鈥
40
39
3X VIEW Y
鈥揗鈥
BV
13
14
A1
S1
鈥揘鈥
27
26
A
S
B1 V1
C
鈥揌鈥
鈥揟鈥
SEATING
PLANE
4X 胃2
4X 胃3
0.10 (0.004) T
VIEW AA
0.05 (0.002) S
C2
C1
VIEW AA
W
胃1
胃
2 X R R1
0.25 (0.010)
GAGE PLANE
K
E
Z
CL
AB
鈥揦鈥
X=L, M, N
G
AB
VIEW Y
PLATING
F
脡脡脡脟脟脡脡脡脟脟脡脡脡脟脟脡脡脡脟脟 J
BASE METAL
U
D
0.13 (0.005) M T L鈥揗 S N S
SECTION AB鈥揂B
ROTATED 90_ CLOCKWISE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE 鈥揌鈥 IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS 鈥揕鈥, 鈥揗鈥 AND 鈥揘鈥 TO BE
DETERMINED AT DATUM PLANE 鈥揌鈥.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE 鈥揟鈥.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE PROTRUSION
IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 10.00 BSC
0.394 BSC
A1 5.00 BSC
0.197 BSC
B 10.00 BSC
0.394 BSC
B1 5.00 BSC
0.197 BSC
C 鈥撯撯 1.70 鈥撯撯 0.067
C1 0.05 0.20 0.002 0.008
C2 1.30 1.50 0.051 0.059
D 0.20 0.40 0.008 0.016
E 0.45 0.75 0.018 0.030
F 0.22 0.35 0.009 0.014
G
0.65 BSC
0.026 BSC
J 0.07 0.20 0.003 0.008
K
0.50 REF
0.020 REF
R1 0.08 0.20 0.003 0.008
S
12.00 BSC
0.472 BSC
S1 6.00 BSC
0.236 BSC
U 0.09 0.16 0.004 0.006
V
12.00 BSC
0.472 BSC
V1
6.00 BSC
0.236 BSC
W
0.20 REF
0.008 REF
Z
1.00 REF
0.039 REF
胃 0_ 7_ 0_ 7_
胃1 0_ 鈥撯撯
0_ 鈥撯撯
胃2
12_ REF
12_ REF
胃3 5_ 13_ 5_ 13_
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