NDS8434A View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
Manufacturer
NDS8434A Datasheet PDF : 10 Pages
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Typical Electrical and ThermalCharacteristics (continued)
60
V DS = - 4.5V
50
TJ= -55°C
40
25°C
30
125°C
20
10
0
0
-6
-12
-18
-24
-30
ID , DRAIN CURRENT (A)
Figure 13. Transconductance Variation with Drain
Current and Temperature.
2.5
1a
2
1.5
1b
1c
1
0.5
0
4.5"x5" FR-4 Board
TA = 2 5o C
Still Air
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in 2)
Figure 14. SO-8 Maximum Steady-State Power
Dissipation versus Copper Mounting Pad Area.
8.5
8
7.5
7
6.5
1b
6
1c
5.5
5
0
1a
4.5"x5" FR-4 Board
TA = 25 o C
Still Air
VG S = - 4 . 5 V
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in 2 )
Figure 15. Maximum Steady- State Drain
Current versus Copper Mounting Pad
Area.
50
30
10
RDS(ON) LIMIT
5
2
1
0.5
VGS = -4.5V
0.1
SINGLE PULSE
0.05 RθJA = See Note 1c
TA A = 25°C
11m00sus
10ms
100ms
1s
10s
DC
0.01
0.1 0.2
0.5
1
2
5
10 20 40
- VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 16. Maximum Safe Operating Area.
1
0.5
0.2
0.1
0.05
0.02
0.01
0.005
0.002
0.001
0.0001
D = 0.5
0.2
0.1
0.05
0.02
0.01
Single Pulse
0.001
0.01
0.1
1
t1, TIME (sec)
RθJA (t) = r(t) * R θJA
R θJA = See note 1c
P(pk)
t1
t2
TJ - TA = P * R θJA(t)
Duty Cycle, D = t1 /t2
10
100
300
Figure 17. Transient Thermal Response Curve.
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
depending on the circuit board design.
NDS8434A Rev.D
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