BYG50 View Datasheet(PDF) - Philips Electronics

Part Name

Description

Manufacturer

BYG50

Controlled avalanche rectifiers

Philips Electronics 

Philips Semiconductors

Controlled avalanche rectifiers

Preliminary specification

BYG50 series

FEATURES

DESCRIPTION

• Glass passivated

• High maximum operating

temperature

DO-214AC; SOD106 surface

mountable package with glass

passivated chip.

• Low leakage current

• Excellent stability

• Guaranteed avalanche energy

absorption capability

• UL 94V-O classified plastic

package

handbook, 4 columns

cathode

band

k

a

• Shipped in 12 mm embossed tape.

Top view

The well-defined void-free case is of a

transfer-moulded thermo-setting

plastic.

Side view

MSA474

Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

PARAMETER

CONDITIONS

VRRM

VR

IF(AV)

IFSM

repetitive peak reverse voltage

BYG50D

BYG50G

BYG50J

BYG50K

BYG50M

continuous reverse voltage

BYG50D

BYG50G

BYG50J

BYG50K

BYG50M

average forward current

non-repetitive peak forward current

averaged over any 20 ms

period; Ttp = 100 °C; see Fig.2

averaged over any 20 ms

period; Al2O3 PCB mounting (see

Fig.7); Tamb = 60 °C; see Fig.3

averaged over any 20 ms

period; epoxy PCB mounting

(see Fig.7); Tamb = 60 °C;

see Fig.3

t = 10 ms half sinewave;

Tj = Tj max prior to surge;

VR = VRRMmax

MIN.

−

−

−

−

−

−

−

−

−

−

−

−

−

−

MAX. UNIT

200 V

400 V

600 V

800 V

1000 V

200 V

400 V

600 V

800 V

1000 V

2.1 A

1.0 A

0.7 A

30 A

1996 May 24

2

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