BYG50 View Datasheet(PDF) - Philips Electronics

Part Name

Description

Manufacturer

BYG50

Controlled avalanche rectifiers

Philips Electronics 

Philips Semiconductors

Controlled avalanche rectifiers

GRAPHICAL DATA

4

handbook, halfpage

IF(AV)

(A)

3

MBH396

2

1

0

0

40

80

120

160

200

Ttp (°C)

VR = VRRMmax; δ = 0.5; a = 1.57.

Fig.2 Maximum permissible average forward

current as a function of tie-point temperature

(including losses due to reverse leakage).

Preliminary specification

BYG50 series

2.0

handIbFo(oAk,Vh)alfpage

(A)

1.6

MBH397

1.2

0.8

0.4

0

0

40

80

120

160

200

Tamb (°C)

VR = VRRMmax; δ = 0.5; a = 1.57.

Device mounted as shown in Fig.7

Solid line: Al2O3 PCB; dotted line: epoxy PCB.

Fig.3 Maximum permissible average forward

current as a function of ambient temperature

(including losses due to reverse leakage).

handboo2k,0h0alfpage

Tj

(°C)

160

120

MGD483

80

D

G

40

J

K

M

0

0

400

800

1200

VR (V)

Device mounted as shown in Fig.7.

Solid line: Al2O3 PCB.

Dotted line: epoxy PCB.

Fig.4 Maximum permissible junction temperature

as a function of reverse voltage.

10

handbooIFk, halfpage

(A)

8

MBH398

6

4

2

0

0

0.4

0.8

1.2

1.6

2.0

VF (V)

Solid line: Tj = 25 °C.

Dotted line: Tj = 175 °C.

Fig.5 Forward current as a function of forward

voltage; maximum values.

1996 May 24

4

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