Reflow Profile
300
215°C, 10–30 s
250
225 C peak
200
150
100
Time above 183°C, 60–150 sec
50
Ramp up = 3C/sec
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
Time (Minute)
• Peak reflow temperature: 225°C (package surface temperature)
• Time of temperature higher than 183°C for 60–150 seconds
• One time soldering reflow is recommended
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74OL60XX Rev. 1.0.4
13
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