MC100E156FNR2(2003) View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
MC100E156FNR2 Datasheet PDF : 8 Pages
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MC10E156, MC100E156
AC CHARACTERISTICS VCCx= 5.0 V; VEE= 0.0 V or VCCx= 0.0 V; VEE= −5.0 V (Note 10)
0°C
25°C
Symbol
Characteristic
Min Typ Max Min Typ Max
fMAX
tPLH
tPHL
Maximum Toggle Frequency
Propagation Delay to Output
700 1100
700 1100
D 400 600 900 400 600 900
SEL0 550 775 1050 550 775 1050
SEL1 450 650 900 450 650 900
LEN 350 500 800 350 500 800
MR 350 600 825 350 600 825
ts
Setup Time
D 400 275
400 275
SEL0 700 300
700 300
SEL1 600 400
600 400
th
Hold Time
D 300 − 275
300 − 275
SEL0 100 − 300
100 − 300
SEL1 200 − 400
200 − 400
tRR
Reset Recovery Time
tPW
Minimum Pulse Width
800 600
MR 400
800 600
400
tSKEW
tJITTER
tr
tf
Within-Device Skew (Note 11)
Random Clock Jitter (RMS)
Rise/Fall Times
(20 - 80%)
50
50
<1
<1
275 475 700 275 475 700
85°C
Min Typ Max Unit
700 1100
MHz
ps
400 600 900
550 775 1050
450 650 900
350 500 800
350 600 825
ps
400 275
700 300
600 400
ps
300 − 275
100 − 300
200 − 400
800 600
ps
ps
400
50
ps
<1
ps
ps
275 475 700
NOTE: Devices are designed to meet the AC specifications shown in the above table, after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 LFPM is maintained.
10. 10 Series: VEE can vary −0.46 V / +0.06 V.
100 Series: VEE can vary −0.46 V / +0.8 V.
11. Within-device skew is defined as identical transitions on similar paths through a device.
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