TMP03 View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
TMP03 Datasheet PDF : 17 Pages
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5V 1
2
TMP03/TMP04
T1 DATA (MICROSECONDS)
T2 DATA (MICROSECONDS)
31
2
5V 2 5 6 9 12 15 16 19
Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8
20
VCC
11
LE
74HC373
OUT 1
GND 10
D1 D2 D3 D4 D5 D6 D7 D8
3 4 7 8 13 14 17 18
3
74HC08
4
6
5
5V 2 5 6 9 12 15 16 19
Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8
20
VCC
11
LE
74HC373
OUT 1
10
GND
D1 D2 D3 D4 D5 D6 D7 D8
3 4 7 8 13 14 17 18
5V 2 5 6 9 12 15 16 19
Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8
20
VCC
11
LE
74HC373
OUT 1
10
GND
D1 D2 D3 D4 D5 D6 D7 D8
3 4 7 8 13 14 17 18
5V 2 5 6 9 12 15 16 19
Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8
20
VCC
11
LE
74HC373
OUT 1
GND 10
D1 D2 D3 D4 D5 D6 D7 D8
3 4 7 8 13 14 17 18
5V 3 4 5 6 10 11 12 13 14
1MHZ
CLOCK
Q0 Q1 Q2 Q3 EN Q0 Q1 Q2 Q3
16
2
VCC
EN
74HC4520 #1
1
CLK
CLK GND RESET RESET
98
7
15
5V 3 4 5 6 10 11 12 13 14
Q0 Q1 Q2 Q3 EN Q0 Q1 Q2 Q3
16
VCC
2
EN
74HC4520 #2
CLK CLK GND RESET RESET
1 9 8 7 15
5V
0.1F 10F
V+
DOUT
TMP04
GND
10k⍀
74HC86
4
6
5
10pF 5V
20pF 1k⍀ 5V
20pF 3.9k⍀
5V
T1
4A
5
B
3 CLR
T2
VCC 16
Q6
Q 7 NC
GND
8
74HC4538
15 14
T1
12 A
11 B
13 CLR
T2
Q 10
Q 9 NC
GND
8
Figure 12. A Hardware Interface for the TMP04
Monitoring Electronic Equipment
The TMP03 are ideal for monitoring the thermal environment
within electronic equipment. For example, the surface-mounted
package will accurately reflect the exact thermal conditions which
affect nearby integrated circuits. The TO-92 package, on the
other hand, can be mounted above the surface of the board, to
measure the temperature of the air flowing over the board.
The TMP03 and TMP04 measure and convert the temperature
at the surface of their own semiconductor chip. When the TMP03
are used to measure the temperature of a nearby heat source,
the thermal impedance between the heat source and the TMP03
must be considered. Often, a thermocouple or other tempera-
ture sensor is used to measure the temperature of the source
while the TMP03 temperature is monitored by measuring T1
and T2. Once the thermal impedance is determined, the tem-
perature of the heat source can be inferred from the TMP03
output.
One example of using the TMP04 to monitor a high power
dissipation microprocessor or other IC is shown in Figure 13.
The TMP04, in a surface mount package, is mounted directly
beneath the microprocessor’s pin grid array (PGA) package. In
a typical application, the TMP04’s output would be connected
to an ASIC where the pulsewidth would be measured (see the
Hardware Interface section of this data sheet for a typical inter-
face schematic). The TMP04 pulse output provides a significant
REV. B
–15–
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