STPS2L40UF(2007) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS2L40UF Datasheet PDF : 8 Pages
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STPS2L40
Characteristics
Figure 3.
Average forward current versus
ambient temperature (δ = 0.5)
SMB flat
IF(AV)(A)
2.2
2.0
Rth(j-a)=Rth(j-l)
1.8
Rth(j-a)=100°C/W
SMB flat
1.6
1.4
1.2
1.0
0.8
0.6
T
0.4
0.2
δ=tp/T
tp
0.0
Tamb(°C)
0
25
50
75
100
125
150
Figure 4.
Non repetitive surge peak forward
current versus overload duration
(maximum values) SMB
IM(A)
12
11
10
9
8
7
6
5
4
3
2
IM
1
0
1.E-03
t
δ=0.5
1.E-02
t(s)
1.E-01
SMB
Ta=25°C
Ta=75°C
Ta=125°C
1.E+00
Figure 5.
IM(A)
30
25
Non repetitive surge peak forward Figure 6.
current versus overload duration
(maximum values) SMB flat
Normalized avalanche power
derating versus pulse duration
SMB flat
(non exposed pad)
PARM(tp)
PARM(1µs)
1
20
15
10
5
IM
0
1.E-03
t
δ=0.5
1.E-02
t(s)
1.E-01
TL=25°C
TL=75°C
TL=125°C
0.1
0.01
0.001
1.E+00
0.01
0.1
tp(µs)
1
10
100
1000
Figure 7.
Normalized avalanche power
derating versus junction
temperature
PARM(tp)
PARM(25°C)
1.2
1
0.8
0.6
0.4
0.2
0
25
50
Tj(°C)
75
100
125
150
Figure 8.
Relative variation of thermal
impedance junction to ambient
versus pulse duration - SMB
Zth(j-a)/Rth(j-a)
1.0
0.9
SMB
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-02
1.E-01
tp(s)
1.E+00
1.E+01
T
δ=tp/T
1.E+02
tp
1.E+03
3/8
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