STPS2L40UF(2007) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS2L40UF Datasheet PDF : 8 Pages
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Characteristics
STPS2L40
Figure 9.
Relative variation of thermal
impedance junction to lead
versus pulse duration - SMB flat
Zth(j-l)/Rth(j-l)
1.0
SMB flat
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-04
1.E-03
tp(s)
1.E-02
1.E-01
T
δ=tp/T
1.E+00
tp
1.E+01
Figure 10. Reverse leakage current versus
reverse voltage applied (typical
values)
IR(mA)
1.E+02
1.E+01
Tj=125°C
1.E+00
1.E-01
1.E-02
1.E-03
0
Tj=25°C
VR(V)
5
10
15
20
25
30
35
40
Figure 11. Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
1000
F=1MHz
VOSC=30mVRMS
Tj=25°C
Figure 12. Forward voltage drop versus
forward current (high level)
IFM(A)
10.0
Tj=125°C
(typical values)
100
Tj=125°C
(maxmimum values)
1.0
Tj=25°C
(maximum values)
10
1
VR(V)
10
VFM(V)
0.1
100
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Figure 13. Forward voltage drop versus
forward current (low level)
Figure 14.
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, eCU=35µm)
IFM(A)
3.0
2.5
Tj=125°C
(typical values)
2.0
1.5
Tj=125°C
(maxmimum values)
1.0
0.5
0.0
0.0
0.1
0.2
0.3
Tj=25°C
(maximum values)
VFM(V)
0.4
0.5
0.6
Rth(j-a)(°C/W)
110
100
90
SMB
80
70
60
50
SMB flat
40
30
20
10
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
4/8
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