MC7410VU400LE View Datasheet(PDF) - Unspecified

Part Name

Description

Manufacturer

MC7410VU400LE

MPC7410 RISC Microprocessor Hardware Specifications

Unspecified 

Electrical and Thermal Characteristics

Table 3. Recommended Operating Conditions 1

Characteristic

Symbol

Recommended

Value

Unit Notes

Core supply voltage

PLL supply voltage

L2 DLL supply voltage

Processor bus supply

voltage

BVSEL = 0

BVSEL = HRESET

BVSEL = ¬HRESET or

BVSEL = 1

VDD

AVDD

L2AVDD

OVDD

OVDD

OVDD

1.8 V ± 100 mV

V

—

1.8 V ± 100 mV

V

—

1.8 V ± 100 mV

V

—

1.8 V ± 100 mV

V

—

2.5 V ± 100 mV

V

—

3.3 V ± 165 mV

V

2, 3

L2 bus supply voltage

L2VSEL = 0

L2VSEL = HRESET or

L2VSEL = 1

L2OVDD

L2OVDD

1.8 V ± 100 mV

V

—

2.5 V ± 100 mV

V

—

Input voltage

Processor bus and

JTAG signals

Vin

GND to OVDD

V

—

L2 bus

Vin

GND to L2OVDD

V

—

Die-junction temperature

Tj

0 to 105

°C

—

Notes:

1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions

is not guaranteed.

2. Mxx7410xxnnnLE (Rev. 1.4) and later only. Previous revisions do not support 3.3 V OVDD and have a

recommended OVDD value of 2.5 V ± 100 mV for BVSEL = 1.

3. Mxx7410xxnnnLE (Rev. 1.4) and later only. Previous revisions do not support BVSEL = ¬HRESET.

Table 4 provides the package thermal characteristics for the MPC7410.

Table 4. Package Thermal Characteristics

Characteristic

Junction-to-ambient thermal resistance, natural convection,

four-layer (2s2p) board

Junction-to-ambient thermal resistance, 1m/sec airflow,

four-layer (2s2p) board

Junction-to-ambient thermal resistance, 2m/sec airflow,

four-layer (2s2p) board

Junction-to-board thermal resistance

Symbol

RθJMA

RθJMA

RθJMA

RθJB

Value

MPC7410 MPC7410 Unit Notes

CBGA

HCTE

18

20

°C/W 1, 2

14

16

°C/W 1, 2

13

15

°C/W 1, 2

9

11

°C/W

3

MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1

10

Freescale Semiconductor

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