MC7410VU400LE View Datasheet(PDF) - Unspecified
Part Name
Description
Manufacturer
MC7410VU400LE Datasheet PDF : 56 Pages
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General Parameters
3 General Parameters
The following list provides a summary of the general parameters of the MPC7410:
Technology
Die size
0.18 µm CMOS, six-layer metal
6.32 mm × 8.26 mm (52 mm2)
Transistor count 10.5 million
Logic design
Fully static
Packages
Surface mount 360 ceramic ball grid array (CBGA)
Surface mount 360 high coefficient of thermal expansion ceramic ball grid array
(HCTE_CBGA)
Surface mount 360 high coefficient of thermal expansion ceramic ball grid array with
lead free C5 spheres (HCTE_CBGA Lead Free C5 Spheres)
Surface mount 360 high coefficient of thermal expansion ceramic land grid array
(HCTE_LGA)
Core power supply 1.8 V ± 100 mV DC (nominal; see Table 3 for recommended operating conditions)
I/O power supply
1.8 V ± 100 mV DC or
2.5 V ± 100 mV
3.3 V ± 165 mV (system bus only)
(input thresholds are configuration pin selectable)
4 Electrical and Thermal Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the MPC7410.
4.1 DC Electrical Characteristics
The tables in this section describe the MPC7410 DC electrical characteristics. Table 1 provides the absolute
maximum ratings.
Table 1. Absolute Maximum Ratings 1
Characteristic
Core supply voltage
PLL supply voltage
L2 DLL supply voltage
Processor bus supply voltage
L2 bus supply voltage
Input voltage
Processor bus
L2 bus
JTAG signals
Storage temperature range
Symbol
VDD
AVDD
L2AVDD
OVDD
L2OVDD
Vin
Vin
Vin
Tstg
Maximum Value
–0.3 to 2.1
–0.3 to 2.1
–0.3 to 2.1
–0.3 to 3.6
–0.3 to 2.8
–0.3 to OVDD + 0.2 V
–0.3 to L2OVDD + 0.2 V
–0.3 to OVDD + 0.2 V
–55 to 150
Unit
V
V
V
V
V
V
V
V
°C
Notes
4
4
4
3, 6
3
2, 5
2, 5
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MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
7
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