LB1976 View Datasheet(PDF) - ON Semiconductor

Part Name

Description

Manufacturer

LB1976

3-phase Brushless Motor Driver

ON Semiconductor 

LB1976

13. Sample calculation for internal power dissipation (approximate)

The calculation assumes the following parameters:

VCC = 5V

VM = 30V

Source-side output transistor ON duty cycle 80% (PWM control)

Output current IO = 1A (RF pin average current)

(1) ICC power dissipation P1

P1 = VCC × ICC = 5V × 14mA = 0.07W

(2) Output drive current power dissipation P2

P2 = VM × 11mA = 30V × 11mA = 0.33W

(3) Source-side output transistor power dissipation P3

P3 = VO(source) × IO × Duty(on) = 0.9V × 1A × 0.8 = 0.72W

(4) Sink-side output transistor power dissipation P4

P4 = VO(sink) × IO = 1.1V × 1A = 1.10W

(5) Total internal power dissipation P

P = P1 + P2 + P3 + P4 = 2.22W

14. IC temperature Rise Measurement

Because the chip temperature of the IC cannot be measured directly, measurement according to one of the following

procedures should always be carried out.

14-1. Thermocouple measurement

A thermocouple element is mounted to the IC heat dissipation fin. This measurement method is easy to implement,

but it will be subject to measurement errors if the temperature is not stable.

14-2. Measurement using internal diode characteristics of IC

This is the recommended measurement method. It makes use of the parasitic diode incorporated in the IC between

FG1 and GND. Set FG1 to High and measure the voltage VF of the parasitic diode to calculate the temperature.

(Our company data: for IF = −1mA, VF temperature characteristics are about −2mV/°C)

15. NC Pins

Because NC pins are electrically open, they may be used for wiring purpose etc.

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