FAN5631 View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
Manufacturer
FAN5631 Datasheet PDF : 14 Pages
| |||
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
VCC
VIN to GND
All other pins to GND
-0.3
6.0
V
-0.3
VIN + 0.3
ILOAD
ΘJC
Load Current
Thermal Resistance Junction-to-Tab(1)
0.5
A
8
°C/W
TL
Lead Temperature, Soldering 10 Seconds
+260
°C
TJ
Junction Temperature
-40
+150
°C
TSTG
Storage Temperature
-65
+150
°C
ESD(2)
Human Body Model, JESD22-A114
2.5
kV
Charged Device Model, JESD22-C101
0.2
Notes:
1. Junction-to-ambient thermal resistance, θJA, is a strong function of PCB material, board thickness, thickness and
number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat
sink characteristics. The estimated value for zero air flow at 0.5W is 60°C/W.
2. Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charged Device Model).
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
VCC
IOUT
TA
Parameter
Supply Voltage Range
Output Current (VIN > 2.V)
Operating Ambient Temperature Range
Min.
2.2
-40
Typ.
+25
Max.
5.5
250
+85
Unit
V
mA
°C
© 2006 Fairchild Semiconductor Corporation
FAN5631/FAN5632 Rev. 1.0.2
4
www.fairchildsemi.com
Share Link: 