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FAN7081-GF085 View Datasheet(PDF) - ON Semiconductor

Part Name
Description
Manufacturer
FAN7081-GF085
ON-Semiconductor
ON Semiconductor ON-Semiconductor
FAN7081-GF085 Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are abso-
lute voltages referenced to COM.
Parameter
High side floating supply offset voltage
High side floating supply voltage
High side floating output voltage
Supply voltage
Input voltage for IN
Power Dissipation 1)
Thermal resistance, junction to ambient 1)
Electrostatic discharge voltage
(Human Body Model)
Charge device model
Junction Temperature
Storage Temperature
Symbol
VS
VB
VHO
VCC
VIN
Pd
Rthja
VESD
VCDM
Tj
TS
Min.
VB-25
-0.3
Vs-0.3
-0.3
-0.3
1K
500
-55
Max.
VB+0.3
625
VB+0.3
25
Vcc+0.3
0.625
200
150
150
Unit
V
V
V
V
V
W
C/W
V
V
C
C
Note: 1) The thermal resistance and power dissipation rating are measured bellow conditions;
JESD51-2: Integrated Circuit Thermal Test Method Environmental Conditions - Natural codition(StillAir)
JESD51-3: Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Package
Recommended Operating Conditions
For proper operations the device should be used within the recommended conditions. -40°C <= Ta <= 125°C
Parameter
High side floating supply voltage(DC)
Transient:-10V@ 0.2 us
High side floating supply offset voltage(DC)
High side floating supply offset voltage(Tran-
sient)
High side floating output voltage
Allowable offset voltage Slew Rate 1)
Supply voltage
Input voltage for IN
Switching Frequency 2)
Minimum Pulse Width(3)
Ambient Temperature
Symbol
VB
VS
VS
VHO
dv/dt
VCC
VIN
Fs
Tpulse
Ta
Min.
VS + 10
-4 (@VBS >= 10V)
-5 (@VBS >= 11.5V)
-25 (~200ns)
-20(200ns ~240ns)
-7(240ns~400ns)
VS
-
10
0
85
-40
Max.
Vs + 20
600
600
VB
50
20
Vcc
200
-
125
Note: 1) Guaranteed by design.
2) Duty = 0.5
3) Guaranteed by design. Refer to Figure4a,4b and 4c on Page 8.
Unit
V
V
V
V
V/ns
V
V
KHz
ns
C
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