HSP50210 View Datasheet(PDF) - Renesas Electronics
Part Name
Description
Manufacturer
HSP50210 Datasheet PDF : 51 Pages
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HSP50210
Plastic Leaded Chip Carrier Packages (PLCC)
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
CL
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
0.004 (0.10) C
0.025 (0.64)
0.045 (1.14)
R
CL
E1 E
D2/E2
D2/E2
VIEW “A”
0.020 (0.51) MAX
3 PLCS
D1
D
0.026 (0.66)
0.032 (0.81)
0.020 (0.51)
A1
MIN
A
-C-
SEATING
PLANE
0.013 (0.33)
0.021 (0.53)
0.045 (1.14)
MIN
0.025 (0.64)
MIN
VIEW “A” TYP.
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions are
not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
4. To be measured at seating plane -C- contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
N84.1.15 (JEDEC MS-018AF ISSUE A)
84 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.165 0.180 4.20
4.57
-
A1
0.090 0.120 2.29
3.04
-
D
1.185 1.195 30.10 30.35
-
D1
1.150 1.158 29.21 29.41
3
D2
0.541 0.569 13.75 14.45
4, 5
E
1.185 1.195 30.10 30.35
-
E1
1.150 1.158 29.21 29.41
3
E2
0.541 0.569 13.75 14.45
4, 5
N
84
84
6
Rev. 2 11/97
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FN3652 Rev.5.00
Jul 2, 2008
Page 51 of 51
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