MGSF3455XT3 View Datasheet(PDF) - ON Semiconductor

Part Name

Description

Manufacturer

MGSF3455XT3

Low RDS(on) Small-Signal MOSFETs Single P-Channel Field Effect Transistors

ON Semiconductor 

MGSF3455XT1

INFORMATION FOR USING THE TSOP−6 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

0.094

2.4

0.037

0.95

0.074

1.9

0.037

0.95

0.039

1.0

TSOP−6

0.028

0.7

inches

mm

TSOP−6 POWER DISSIPATION

The power dissipation of the TSOP−6 is a function of the

drain pad size. This can vary from the minimum pad size for

soldering to a pad size given for maximum power

dissipation. Power dissipation for a surface mount device is

determined by TJ(max), the maximum rated junction

temperature of the die, RθJA, the thermal resistance from

the device junction to ambient, and the operating

temperature, TA. Using the values provided on the data

sheet for the TSOP−6 package, PD can be calculated as

follows:

PD =

TJ(max) − TA

RθJA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values

into the equation for an ambient temperature TA of 25°C,

one can calculate the power dissipation of the device which

in this case is 400 milliwatts.

PD =

150°C − 25°C

300°C/W

= 400 milliwatts

The 300°C/W for the TSOP−6 package assumes the use

of the recommended footprint on a glass epoxy printed

circuit board to achieve a power dissipation of 400

milliwatts. There are other alternatives to achieving higher

power dissipation from the TSOP−6 package. Another

alternative would be to use a ceramic substrate or an

aluminum core board such as Thermal Clad™. Using a

board material such as Thermal Clad, an aluminum core

board, the power dissipation can be doubled using the

same footprint.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within a

short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

• Always preheat the device.

• The delta temperature between the preheat and

soldering should be 100°C or less.*

• When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering method,

the difference shall be a maximum of 10°C.

• The soldering temperature and time shall not exceed

260°C for more than 10 seconds.

• When shifting from preheating to soldering, the

maximum temperature gradient shall be 5°C or less.

• After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and

result in latent failure due to mechanical stress.

• Mechanical stress or shock should not be applied

during cooling.

* Soldering a device without preheating can cause

excessive thermal shock and stress which can result in

damage to the device.

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