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MKL33Z128VLH4 View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
Manufacturer
MKL33Z128VLH4 Datasheet PDF : 65 Pages
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Table of Contents
1 Ratings.................................................................................. 4
1.1 Thermal handling ratings............................................... 4
1.2 Moisture handling ratings...............................................4
1.3 ESD handling ratings..................................................... 4
1.4 Voltage and current operating ratings............................4
2 General................................................................................. 5
2.1 AC electrical characteristics...........................................5
2.2 Nonswitching electrical specifications............................5
2.2.1 Voltage and current operating requirements......6
2.2.2 LVD and POR operating requirements.............. 6
2.2.3 Voltage and current operating behaviors........... 7
2.2.4 Power mode transition operating behaviors.......8
2.2.5 Power consumption operating behaviors...........9
2.2.6 EMC radiated emissions operating behaviors... 19
2.2.7 Designing with radiated emissions in mind........ 20
2.2.8 Capacitance attributes....................................... 20
2.3 Switching specifications................................................. 20
2.3.1 Device clock specifications................................ 20
2.3.2 General switching specifications........................21
2.4 Thermal specifications................................................... 21
2.4.1 Thermal operating requirements........................21
2.4.2 Thermal attributes.............................................. 22
3 Peripheral operating requirements and behaviors................ 22
3.1 Core modules................................................................ 22
3.1.1 SWD electricals .................................................23
3.2 System modules............................................................ 24
3.3 Clock modules............................................................... 24
3.3.1 MCG-Lite specifications..................................... 24
3.3.2 Oscillator electrical specifications...................... 26
3.4 Memories and memory interfaces................................. 28
3.4.1 Flash electrical specifications............................ 28
3.5 Security and integrity modules.......................................30
3.6 Analog............................................................................30
3.6.1 ADC electrical specifications..............................30
3.6.2 Voltage reference electrical specifications.........35
3.6.3 CMP and 6-bit DAC electrical specifications......36
3.6.4 12-bit DAC electrical characteristics.................. 38
3.7 Timers............................................................................ 41
3.8 Communication interfaces............................................. 41
3.8.1 SPI switching specifications...............................41
3.8.2 I2C..................................................................... 46
3.8.3 UART................................................................. 48
3.8.4 I2S/SAI switching specifications........................ 48
3.9 Human-machine interfaces (HMI).................................. 52
3.9.1 LCD electrical characteristics.............................52
4 Dimensions........................................................................... 54
4.1 Obtaining package dimensions......................................54
5 Pinouts and Packaging......................................................... 54
5.1 KL33 Signal Multiplexing and Pin Assignments.............54
5.2 KL33 Family Pinouts...................................................... 57
6 Ordering parts....................................................................... 59
6.1 Determining valid orderable parts.................................. 59
7 Part identification...................................................................59
7.1 Description..................................................................... 59
7.2 Format........................................................................... 60
7.3 Fields............................................................................. 60
7.4 Example......................................................................... 60
8 Terminology and guidelines.................................................. 61
8.1 Definitions...................................................................... 61
8.2 Examples....................................................................... 61
8.3 Typical-value conditions................................................ 62
8.4 Relationship between ratings and operating
requirements.................................................................. 62
8.5 Guidelines for ratings and operating requirements........ 63
9 Revision History.................................................................... 63
Kinetis KL33 Microcontroller, Rev.5, 08/2015.
3
Freescale Semiconductor, Inc.

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