NE85002 View Datasheet(PDF) - California Eastern Laboratories.
Part Name
Description
Manufacturer
NE85002 Datasheet PDF : 6 Pages
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NE85002 SERIES
RF TEST CIRCUIT
RF
POWER
SOURCE
GATE
1 KΩ
S1
BIAS
SUPPLY
S2
DRAIN
VDS = 10 V
ID = 450 mA
20dB
DIRECTIONAL
COUPLER
Circulator
BIAS
TEE
TUNER
D.U.T.
TUNER
BIAS
TEE
10 dB
ATTN.
POWER
METER
POWER
METER
30 dB
ATTN.
BIASING PROCEDURE
Turn on the power supply.
Make sure its voltage is 0 V.
Turn on S1 and S2. Apply
VGS = -5, then apply VDS = 10 V.
Decrease VGS to obtain the
required drain current, ID. Apply
the RF input and adjust the gate
voltage to maintain the desired
drain current. Do not exceed a
gate current of 10 mA
(IG = 10 mA max).
OUTLINE DIMENSIONS AND HANDLING
PACKAGE OUTLINE 95
(Units in mm)
φ2.5±0.3
2 PLACES
SOURCE
0.7±0.1
GATE
4.0 MIN
5.9±0.2
2.1±0.15
+.06
0.1 -.02
DRAIN
6.5±0.3
14.0±0.15
18.0±0.5
0.2 MAX 7.2±0.2
4.5 MAX
1.2
NE8500200 (CHIP)
(Units in µm)
100
240
110
100
640
100
90
100
1800
DIE ATTACHMENT
Die attach can be accomplished with either Au-Ge (390±10°C) or
Au-Sn (290 ± 10°C) preforms in a forming gas environment. Epoxy
die attach is not recommended.
BONDING
Gate and drain bonding wires should be minimum length, semi-
hard fold wire (3-8% elongation) 30 microns or less in diameter.
The source should be connected with gold ribbon or mesh.
Bonding should be performed with a wedge tip that has a taper of
approximately 15°. Die attach and bonding time should be kept to
a minimum. As a general rule, the bonding operation should be
kept within a 300°C - 10 minute curve. If longer periods are
required, the temperature should be lowered.
PRECAUTIONS
The user must operate in a clean, dry environment. The chip
channel is glassivated for mechanical protection only and does not
preclude the necessity of a clean environment.
The bonding equipment should be periodically checked for sources
of surge voltage and should be properly grounded at all times. All
test and handling equipment should be grounded to minimize the
possibilities of static discharge.
See AN-1001 Recommended Handling Procedure for Microwave
Transistor & MMIC Chips for additional infromation.
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
EXCLUSIVE NORTH AMERICAN AGENT FOR NEC RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279
DATA SUBJECT TO CHANGE WITHOUT NOTICE
Internet: http://WWW.CEL.COM
06/26/2002
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