EMA303D-1 View Datasheet(PDF) - Excelics Semiconductor, Inc.

Part Name

Description

Manufacturer

EMA303D-1

17.5 - 26 GHz Medium Power MMIC

Excelics Semiconductor, Inc. 

DATA SHEET

17.5 - 26 GHz Medium Power MMIC

ASSEMBLY DRAWING

Vdd

0.1 uF

50 ohm line on Alumina

RF INPUT

50pF

EMA303D-1

50 ohm line on Alumina

RF OUTPUT

0.1 uF

50pF

VGG

The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line and

separate the wires to minimize the mutual inductance.

CHIP OUTLINE

1060

GND

for DC check

VD 1

750

VD2

1500

VD3

2350

RF IN

680

RF OUT

550

0

0

700

VGG1

1150

VGG1

Chip Size 1060 x 2500 microns

Chip Thickness: 75 ± 13 microns

PAD Dimensions: 1. DC 100 x 100 microns

2. RF 80 x 68 microns

All Dimensions In Microns

GND

2065

VGG1

2500

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