TS4962 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

TS4962

3W Filter-free Class D Audio Power Amplifier

STMicroelectronics 

Package Mechanical Data

4 Package Mechanical Data

4.1 Pin-out and markings for 9-bump flip-chip

Figure 61. Pin-out for 9-bump flip-chip (top view)

IN+

1/A1

VDD

4/B1

IN-

7/C1

GND

2/A2

VDD

5/B2

STBY

8/C2

OUT-

3/A3

GND

6/B3

OUT+

9/C3

■ Bumps are underneath

■ Bump diameter = 300µm

Figure 62. Marking for 9-bump flip-chip (top view)

E

A62

YWW

Marking: A62

■ ST Logo

■ Part Number: A62

■ Three digits Datecode: YWW

■ E symbol for lead-free only

■ The dot is for marking pin A1

TS4962

4.2 Mechanical data for 9-bump flip-chip

1.60 mm

0.5mm

1.60 mm

■ Die size: 1.6mm x 1.6mm ±30µm

■ Die height (including bumps): 600µm

■ Bump diameter: 315µm ±50µm

■ Bump diameter before Reflew: 300µm ±10µm

■ Bump height: 250µm ±40µm

■ Die Height: 350µm ±20µm

■ Pitch: 500µm ±50µm

■ *Back Coating layer Height: 100µm ±10µm

■ Coplanarity: 60µm max

0.5mm

∅ 0.25mm

* Optional

100µm

600µm

21/22

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