MB1M-BP-HF View Datasheet(PDF) - Micro Commercial Components

Part Name

Description

Manufacturer

MB1M-BP-HF

0.5 Amp Single Phase Glass Passivated Bridge Rectifier 50 to 1000 Volts

Micro Commercial Components 

MCC

TM

Micro Commercial Components

 omponents

20736 Marilla Street Chatsworth



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MB05M

THRU

MB10M

Features

x Glass Passivated Diode Construction

x High Surge Overload Rating:35A peak

x Saves Space on Printed Circuit Board

x High Temperature Soldering Guaranteed: 260к/10 Second

• Halogen free available upon request by adding suffix "-HF"

• Epoxy meets UL 94 V-0 flammability rating

• Moisture Sensitivity Level 1

• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates

Compliant. See ordering information)

x Terminals: Plated Leads Solderable per MIL-STD-750, Method

2026

0.5 Amp Single Phase

Glass Passivated

Bridge Rectifier

50 to 1000 Volts

MB-1

Maximum Ratings

MCC

Part

Number

MB05M

MB1M

MB2M

MB4M

MB6M

MB8M

MB10M

Device

Marking

MB05M

MB1M

MB2M

MB4M

MB6M

MB8M

MB10M

Maximum

Recurrent

Peak Reverse

Voltage

50V

100V

200V

400V

600V

800V

1000V

Maximum

RMS

Voltage

35V

70V

140V

280V

420V

560V

700V

Maximum

DC

Blocking

Voltage

50V

100V

200V

400V

600V

800V

1000V

Electrical Characteristics @ 25OC Unless Otherwise Specified

Average Forward

Current

IF(AV)

0.5 A(1)

0.8 A(2)

See Fig.1

Peak Forward Surge IFSM

Current

35A 8.3ms, half sine

Maximum

Instantaneous

Forward Voltage

Maximum DC

Reverse Current At

Rated DC Blocking

Voltage

Typical Thermal

Resistance

Typical Junction

Capacitance

Rating For Fusing

Operating Junction

and Storage

Temperature Range

VF

IR

RTJA

RTJA

RTJL

CJ

I2t

TJ

TSTG

1.0V

IFM = 0.4A;

TA = 25OC

5PA

100PA

TA = 25к

TA = 125к

85к/W(1)

70к/W(2)

20к/W(1)

13pF

5.0A2s

-55to+150

к

per leg

Measured at

1.0MHz, VR=4.0V

t<8.30ms

Notes: 1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7

2. On glass epoxy P.C.B. mounted on 0.05 x 0.05”(1.3 x 1.3mm)pads

3. On aluminum substrate P.C.B. with an area of 0.8” x 0.8”(20 x 20mm) mounted

on 0.05 x 0.05”(1.3x 1.3mm) solder pad

∼

∼





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E









+



~

-

~

Case Style



    















A

.195

.205

4.95

5.21

B

.095

.105

2.41

2.67

C

.144

.161

3.65

4.10

D

.179

.190

4.55

4.83

E

.039

.049

0.99

1.24

F

.090

.106

2.30

2.70

G

.017

.029

0.43

0.74

H

.132

.203

3.35

5.16

K

.006

.016

0.15

0.41

L

.137

.147

3.48

3.73



 1

  5

 1

  5

N

.020

.028

0.51

0.71



Revision: C

www.mccsemi.com

1 of 3

2013/12/13

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