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BYG26 View Datasheet(PDF) - Philips Electronics

Part Name
Description
Manufacturer
BYG26 Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Philips Semiconductors
SMA ultra fast soft-recovery
controlled avalanche rectifiers
Product specification
BYG26 series
PACKAGE OUTLINE
Transfer-moulded thermo-setting plastic small rectangular surface mounted package;
2 connectors
SOD124
H
D
A
A1
c
Q
Eb
(1)
0
2.5
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
b
c
D
E
H
Q
mm
2.3
2.0
0.05
1.6
1.4
0.2
4.5
4.3
2.8
2.4
5.5
5.1
3.3
2.7
Note
1. The marking band indicates the cathode.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
SOD124
DO-214AC
2000 Feb 14
7
5 mm
EUROPEAN
PROJECTION
ISSUE DATE
99-10-22

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