EL5120 View Datasheet(PDF) - Renesas Electronics
Part Name
Description
Manufacturer
EL5120 Datasheet PDF : 21 Pages
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EL5120, EL5220, EL5420
Package Outline Drawing
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 3, 10/09
A
13
5.00 ±0.10
14
8
6.40
4.40 ±0.10
2
3
PIN #1
I.D. MARK
SEE
DETAIL "X"
0.20 C B A
1
7
0.65
B
TOP VIEW
H
C
SEATING
PLANE
0.10 C
0.05
1.20 MAX
0.25 +0.05/-0.06 5
0.10 CBA
SIDE VIEW
0.09-0.20
END VIEW
1.00 REF
0.90 +0.15/-0.10
0.05 MIN
0.15 MAX
DETAIL "X"
GAUGE
PLANE
0.25
0°-8°
0.60 ±0.15
(1.45)
(5.65)
(0.65 TYP)
(0.35 TYP)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.80mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153, variation AB-1.
FN7186 Rev 8.00
October 15, 2015
Page 21 of 21
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