ADN2847
2620m
GND2 GND2
IMMON VCC3 FAIL
CLKSEL GND
IDTONE IBMON GND3 ALS DEGRADE GND
GND2
VCC2
IMODN
IMODN
GND2
IMODP
IMODP
GND2
GND2
IBIAS
IBIAS
CCBIAS
GND
CLKN
CLKP
GND1
DATAP
DATAN
GND1
VCC1
GND
PAVCAP
ERCAP
GND
ASET PSET IMPD IMPDMON2 GND4
LBWSET ERSET GND IMPDMON
IMPD2
VCC4
Figure 2. Metallization Photograph
2280m
DIE ROTATED 90؇ IN PACKAGE
1
2620m
Figure 3. Bonding Diagram
Pad Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
Pad Name
TP1 (GND)
LBWSET
ASET
ERSET
PSET
TP2 (GND)
IMPD
IMPDMON
IMPDMON2
IMPD2
GND4
VCC4
ERCAP
PAVCAP
TP3 (GND)
VCC1
GND1
DATAN
DATAP
GND1
CLKP
CLKN
TP4 (GND)
TP5 (GND)
TP6 (GND)
CLKSEL
DEGRADE
FAIL
ALS
x[m]
–996
–996
–996
–996
–996
–996
–996
–996
–996
–996
–996
–995
–925
–777
–606
–389
–200
–70
83
263
442
596
762
996
996
996
996
996
996
DIE PAD COORDINATES*
Y[m]
1026
853
679
506
332
159
–15
506
–361
–534
–724
–964
–1191
–1191
–1191
–1191
–1191
–1191
–1191
–1191
–1191
–1191
–1191
–1109
–935
–762
–589
–415
–242
Pad Number Pad Name
x[m]
30
VCC3
996
31
GND3
996
32
IMMON
996
33
IBMON
996
34
GND2
996
35
IDTONE
995
36
GND2
995
37
GND2
867
38
VCC2
713
39
IMODN
500
40
IMODN
396
41
GND2
242
42
IMODP
88
43
IMODP
–16
44
GND2
–239
45
GND2
–443
46
IBIAS
–633
47
IBIAS
–772
48
CCBIAS
–912
*With the origin in the center of the die (see Figure 2).
–4–
Y[m]
–19
251
441
614
804
993
1133
1191
1191
1191
1191
1191
1191
1191
1191
1191
1191
1191
1191
REV. 0