MPX4115AP View Datasheet(PDF) - Motorola => Freescale
Part Name
Description
Manufacturer
MPX4115AP Datasheet PDF : 9 Pages
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FLUORO SILICONE
GEL DIE COAT
WIRE BOND
LEAD
FRAME
Freescale SemiconductorM, PIXn4c1.15A MPXA4115A SERIES
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
+5 V
STAINLESS
STEEL CAP
P1
THERMOPLASTIC
CASE
Vout
Vs
IPS
OUTPUT
1.0 mF
0.01 mF
GND
470 pF
ABSOLUTE ELEMENT
SEALED VACUUM REFERENCE
DIE BOND
Figure 2. Cross Sectional Diagram SOP
(not to scale)
Figure 2 illustrates the absolute sensing chip in the basic
chip carrier (Case 482).
Figure 3. Recommended power supply decoupling
and output filtering.
For additional output filtering, please refer to
Application Note AN1646.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D in-
put of a microprocessor or microcontroller. Proper decoup-
ling of the power supply is recommended.
5.0
4.5 TRANSFER FUNCTION:
MAX
4.0
Vout = Vs* (.009*P-.095) ± Error
VS = 5.1 Vdc
3.5 TEMP = 0 to 85°C
TYP
3.0
2.5
2.0
1.5
MIN
1.0
0.5
0
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical minimum and maximum output curves
are shown for operation over 0 to 85°C temperature range.
The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire
bonds from the environment, while allowing the pressure
signal to be transmitted to the silicon diaphragm. The
MPX4115A/MPXA4115A series pressure sensor operating
characteristics, internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor perfor-
mance and long–term reliability. Contact the factory for
information regarding media compatibility in your application.
Motorola Sensor Device Data For More Information On This Product,
3
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