MPXA4100A View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
Manufacturer
MPXA4100A Datasheet PDF : 13 Pages
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Pressure
On-chip Temperature Compensation and Calibration
Figure 2 illustrates an absolute sensing chip in the basic
chip carrier (Case 867). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the sensor
diaphragm. The MPX4100A series pressure sensor
operating characteristics, and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media, other than dry air, may have adverse effects on
sensor performance and long-term reliability. Contact the
factory for information regarding media compatibility in your
application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 3.
(The output will saturate outside of the specified pressure
range.)
Fluoro Silicone
Gel Die Coat
Wire Bond
Stainless Steel
Metal Cover
Epoxy Plastic
Case
Lead Frame
Die
Absolute Element
Bond
P2
Figure 2. Cross-Sectional Diagram (not to scale)
+5 V
1.0 μF
Vout
Vs
IPS
0.01 μF
GND
Output
470 pF
Figure 3. Recommended Power Supply Decoupling and Output Filtering
(For output filtering recommendations, refer to Application Note AN1646.)
5.0
4.5
Transfer Function:
VOUT = VS* (.01059*P-0.1518) ± Error
4.0 VS = 5.1 Vdc
3.5 TEMP = 0 to 85°C
20 kPa to 105 kPa
3.0 MPX4100A
MAX
TYP
2.5
2.0
1.5
MIN
1.0
0.5
0
Pressure (ref. to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Sensors
Freescale Semiconductor
MPX4100A
5
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