MPXA4100A View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

Manufacturer

MPXA4100A

Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

Pressure

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

The two sides of the pressure sensor are designated as

the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing fluorosilicone gel,

which protects the die from harsh media. The MPX pressure

sensor is designed to operate with positive differential

pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the

following table:

Part Number

MPX4100A

MPX4100AP

MPX4100AS

MPXAZ4100A6U, MPXA4100A6U/TI

MPXAZ4100AC6U, MPXA4100AC6U

Case Type

867

867B

867E

482

482A

Pressure (P1) Side Identifier

Stainless Steel Cap

Side with Part Marking

Side with Port Attached

Side with Part Marking

Side with Port Attached

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

0.660

16.76

0.100 TYP 8X

2.54

0.060 TYP 8X

1.52

0.300

7.62

0.100 TYP 8X

2.54

inch

mm SCALE 2:1

Figure 5. SOP Footprint (Case 482)

Sensors

Freescale Semiconductor

MPX4100A

7

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