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TSM1N80CWRPG View Datasheet(PDF) - TSC Corporation

Part Name
Description
Manufacturer
TSM1N80CWRPG
TSC
TSC Corporation TSC
TSM1N80CWRPG Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
TSM1N80
Taiwan Semiconductor
N-Channel Power MOSFET
800V, 0.3A, 21.6
FEATURES
Advanced planar process
100% avalanche tested
Fast switching
APPLICATION
Power Supply
Lighting
KEY PERFORMANCE PARAMETERS
PARAMETER
VALUE
UNIT
VDS
800
V
RDS(on) (max)
21.6
Qg
5
nC
SOT-223
Notes: Moisture sensitivity level: level 3. Per J-STD-020
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current (Note 1)
Single Pulse Avalanche Energy (Note 2)
Avalanche Current, Repetitive or Not-Repetitive (Note 1)
Total Power Dissipation @ TC = 25°C
Operating Junction Temperature
Operating Junction and Storage Temperature Range
VDS
VGS
ID
IDM
EAS
IAR
PDTOT
TJ
TJ, TSTG
800
±30
0.3
1
90
1
2.1
150
- 55 to +150
UNIT
V
V
A
A
mJ
A
W
°C
°C
THERMAL PERFORMANCE
PARAMETER
SYMBOL
LIMIT
UNIT
Junction to Ambient Thermal Resistance
RӨJA
60
°C/W
Notes: RӨJA is the sum of the junction-to-case and case-to-ambient thermal resistances. The case thermal reference is defined
at the solder mounting surface of the drain pins. RӨJA is guaranteed by design while RӨCA is determined by the user’s board
design. RӨJA shown below for single device operation on FR-4 PCB in still air
Document Number: DS_P0000037
1
Version: B15

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