T8302 View Datasheet(PDF) - Taiwan Memory Technology
Part Name
Description
Manufacturer
T8302 Datasheet PDF : 12 Pages
| |||
tm TE
CH
PACKAGE DIMENSIONS
8-LEAD SOP
B
B1
K
T h e rm a l P a d *
J
A1 A
T8302
C1 C
C2
D
H
F
E
Symbol
A
A1
B
B1
C
C1
C2
D
E
F
J
K
H
Min.
5.70
3.75
-
-
-
1.35
0
0.31
0.30
0.10
Dimension in mm
Typ.
Max.
6.00
6.30
3.95
4.10
-
5.13
1.27
-
-
1.80
1.55
1.75
-
0.15
0.41
0.51
0.50
0.70
0.15
0.25
2.23 REF
2.97 REF
0~8°
Dimension in inch
Min.
Typ.
Max.
0.224
0.236
0.248
0.148
0.156
0.164
-
-
0.202
-
0.050
-
-
-
0.071
0.052
0.061
0.069
0.000
-
0.006
0.012
0.016
0.020
0.012
0.020
0.028
0.004
0.006
0.010
0.088 REF
0.117 REF
0~8°
*Note :
The thermal pad on the IC’s bottom has to be mounted on the copper foil.
To eliminate the noise influence, the thermal pad is suggested to be connected to GND on PCB.
In addition, desired thermal conductivity will be improved, if a heat-conducting copper foil on
PCB is soldered with thermal pad. The thermal pad enhances the power dissipation. As a result, a
large amount of current can be sunk safely in one package.
TM Technology, Inc. reserves the right
P. 11
to change products or specifications without notice.
Publication Date:April 2014
Revision: E
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