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HMC339 View Datasheet(PDF) - Analog Devices

Part Name
Description
Manufacturer
HMC339 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
v02.1007
Absolute Maximum Ratings
RF / IF Input (Vdd = +5V)
LO Drive (Vdd = +5V)
Vdd
Continuous Pdiss (Ta = 85 °C)
(derate 2.64 mW/°C above 85 °C)
Storage Temperature
Operating Temperature
+13 dBm
+13 dBm
+5.5V
238 mW
-65 to +150 °C
-55 to +85 °C
Outline Drawing
HMC339
GaAs MMIC SUB-HARMONICALLY
PUMPED MIXER, 33 - 42 GHz
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
3
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS IN INCHES (MILLIMETERS)
2. ALL TOLERANCES ARE ±0.001 (0.025)
3. DIE THICKNESS IS 0.004 (0.100) BACKSIDE IS GROUND
4. BOND PADS ARE 0.004 (0.100) SQUARE
5. BOND PAD SPACING, CTR-CTR: 0.006 (0.150)
6. BACKSIDE METALLIZATION: GOLD
7. BOND PAD METALLIZATION: GOLD
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