LL014N View Datasheet(PDF) - VBsemi Electronics Co.,Ltd
Part Name
Description
Manufacturer
LL014N Datasheet PDF : 8 Pages
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LL014N
N-Channel 60-V (D-S) MOSFET
www.VBsemi.tw
PRODUCT SUMMARY
VDS (V)
RDS(on) (Ω)
0.076 at VGS = 10 V
60
0.085 at VGS = 4.5 V
ID (A)a
4.5
3.5
Qg (Typ.)
10 nC
FEATURES
• Halogen-free
• TrenchFET® Power MOSFET
APPLICATIONS
• Load Switches for Portable Devices
RoHS
COMPLIANT
SOT-223-3
D
S
D
G
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
60
V
VGS
± 20
TC = 25 °C
4.5
Continuous Drain Current (TJ = 150 °C)
TC = 70 °C
TA = 25 °C
ID
3.2 a
2.7
TA = 70 °C
2.3
A
Pulsed Drain Current
IDM
20
Continuous Source-Drain Diode Current
TC = 25 °C
TA = 25 °C
IS
3.2
2.1b, c
TC = 25 °C
4.0
Maximum Power Dissipation
TC = 70 °C
TA = 25 °C
PD
3.0
2.5b, c
W
TA = 70 °C
1.6b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)e, f
TJ, Tstg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambienta, c, d
t≤5s
RthJA
40
Maximum Junction-to-Foot (Drain)
Steady State
RthJF
15
50
°C/W
20
Notes:
a. Package limited, TC = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 95 °C/W.
e. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result
of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure
adequate bottom side solder interconnection.
f. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
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