MC9S08PT16VLD
Parameter Classification
4 Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods.
To give the customer a better understanding, the following classification is used and the
parameters are tagged accordingly in the tables where appropriate:
Table 2. Parameter Classifications
P
Those parameters are guaranteed during production testing on each individual device.
C
Those parameters are achieved by the design characterization by measuring a statistically relevant sample size
across process variations.
T
Those parameters are achieved by design characterization on a small sample size from typical devices under
typical conditions unless otherwise noted. All values shown in the typical column are within this category.
D
Those parameters are derived mainly from simulations.
NOTE
The classification is shown in the column labeled “C” in the
parameter tables where appropriate.
5 Ratings
5.1 Thermal handling ratings
Symbol
TSTG
TSDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
Notes
°C
1
°C
2
1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
5.2 Moisture handling ratings
Symbol Description
MSL Moisture sensitivity level
Min.
—
Max.
3
Unit
Notes
—
1
1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
MC9S08PT16 Series Data Sheet, Rev. 4, 03/2020
NXP Semiconductors
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