MC9S08PA60VLD View Datasheet(PDF) - NXP Semiconductors.
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MC9S08PA60VLD Datasheet PDF : 41 Pages
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Table of Contents
1 MCU block diagram...........................................................................4
6.2.2 Debug trace timing specifications................................19
2 Orderable part numbers......................................................................6
6.2.3 FTM module timing.....................................................20
3 Part identification............................................................................... 7
6.3 Thermal specifications...............................................................21
3.1 Description.................................................................................7
6.3.1 Thermal operating requirements.................................. 21
3.2 Format........................................................................................7
6.3.2 Thermal characteristics................................................ 21
3.3 Fields..........................................................................................7
7 Peripheral operating requirements and behaviors.............................. 22
3.4 Example..................................................................................... 7
7.1 External oscillator (XOSC) and ICS characteristics..................22
4 Parameter Classification.....................................................................8
7.2 NVM specifications................................................................... 24
5 Ratings................................................................................................8
7.3 Analog........................................................................................25
5.1 Thermal handling ratings...........................................................8
7.3.1 ADC characteristics..................................................... 25
5.2 Moisture handling ratings.......................................................... 8
7.3.2 Analog comparator (ACMP) electricals...................... 28
5.3 ESD handling ratings.................................................................9
7.4 Communication interfaces......................................................... 29
5.4 Voltage and current operating ratings........................................9
7.4.1 SPI switching specifications........................................ 29
6 General............................................................................................... 10
8 Dimensions.........................................................................................32
6.1 Nonswitching electrical specifications...................................... 10
8.1 Obtaining package dimensions.................................................. 32
6.1.1 DC characteristics........................................................ 10
9 Pinout................................................................................................. 33
6.1.2 Supply current characteristics...................................... 16
9.1 Signal multiplexing and pin assignments.................................. 33
6.1.3 EMC performance........................................................17
9.2 Device pin assignment...............................................................35
6.2 Switching specifications............................................................ 18
10 Revision history................................................................................. 39
6.2.1 Control timing..............................................................18
MC9S08PA60 Series Data Sheet, Rev. 4, 09/2019
NXP Semiconductors
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