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DSA6341JL2JB-T View Datasheet(PDF) - Microchip Technology

Part Name
Description
Manufacturer
DSA6341JL2JB-T Datasheet PDF : 26 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
DSA63XX
5.0 SOLDER REFLOW PROFILE
260°C
20-40
Seconds
FIGURE 5-1:
217°C
200°C
150°C
25°C
60-180
Seconds
Pre-Heat
8 minutes max.
Solder Reflow Profile.
60-150
Seconds
Reflow
Cool
Time
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
Preheat Time 150°C to 200°C
Time maintained above 217°C
Peak Temperature
Time within 5°C of actual Peak
Ramp-Down Rate
Time 25°C to Peak Temperature
3°C/sec. max.
60 to 180 sec.
60 to 150 sec.
255°C to 260°C
20 to 40 sec.
6°C/sec. max.
8 minutes max.
DS20006189A-page 10
2019 Microchip Technology Inc.

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