Prepared
Checked
Approved
Product Specifications
AN7522N
Ref No.
F-1
Total Page
9
Page No.
7
(Structure Description)
Chip surface passivation SiN,
PSG,
Others (
Lead frame material
Fe group,
Cu group,
Others (
Inner lead surface process Ag plating,
Au plating,
Others (
Outer lead surface process Solder plating, Solder dip,
Others (
Chip mounting method Ag paste,
Au-Si alloy, Solder, Others (
Wire bonding method
Thermalsonic bonding,
Others (
Wire material, Diameter Au,
Diameter 38 µm Others (
Mold material
Epoxy,
Others (
Molding method
Transfer mold, Multiplunger mold, Others (
Fin material
Cu Group
Others (
)1
) 2, 6
)2
)6
)3
)4
)4
)5
)5
)7
Package FP-12S
1
43
5
6
2
Eff. Date Eff. Date Eff. Date
25-APR-2000 21-JUL-2000
FMSC-PSDA-002-01
Eff. Date
Matsushita Electronics Corporation