The graph shown below displays MTTF in hours x ampere2
emitter current for each of the “Super 2.0 GHz” devices. Life
tests at elevated temperatures have correlated to better than
±10% to the theoretical prediction for metal failure. Sample
MTTF calculations based on operating conditions are in-
cluded on the graph.
100
10
1
0.1
MRW2003
0.01
MRW2001
0.001
70
90
110
130 150
170
TJ, JUNCTION TEMPERATURE (°C)
190 210
Figure 4. MTTF Factor
50 Ω
Cfo
Bt
Cx
50 Ω
C
CC
MRW2001
2.0 GHz
Board Material = 0.062″ Glass-Teflon εr = 2.55
Cfo
50 Ω
RFC
Cx
50 Ω
CC
MRW2003
2.0 GHz
Board Material = 0.020″ Glass-Teflon εr = 2.55
Figure 5. PC Board Layouts
MRW2001 MRW2003
4
MOTOROLA RF DEVICE DATA