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PC3H4A(1998) View Datasheet(PDF) - Sharp Electronics

Part Name
Description
Manufacturer
PC3H4A
(Rev.:1998)
Sharp
Sharp Electronics Sharp
PC3H4A Datasheet PDF : 14 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
SHARP CORPORATION
ED-96027A
1 September 30, 1998
MODEL No.
PC3H4
PAGE
7/11
4. Reliability
The reliability of products shall satisfy
items listed below.
Test Items
Test Conditions
*1
Solderability *2
23O”C, 5 s
Soldering heat l 3
26O”C, 10s
Terminal strength
(Bending) l 4
Weight : IN
1 time/each terminaI
Mechanical shock
15000m/s’, 0.5ms
3 times/ +X, +Y, +Z direction
Variable frequency
vibration
100 to 2000 to 1ooHz/4min
200m/s2
4 times/ X, Y, Z direction
Temperature
cycling
1 cycle -40°C to t125”C
(30min) (30min)
20 cycles test
High temp. and high +85”C, 85%RH, 500h
*5
humidity storage
High temp. storage
+125C, lOOOh
Low temp. storage
-40°C. 1 OOOh
Operation Iife
I,=t50mA, Ptot= 170mW
Ta=25”C, 1 OOOh
Confidence level : 90%
LTPD: 10%/20%
Failure Judgement
Criteria
Samples (n)
Defective(C)
n=ll, C=O
n=ll, C=O
v,>ux 1.2
n=ll, C=O
EEO >ux2
Ic<LX0.7
V CEbat) > ” ’ ‘2
n=ll. C=O
n=ll, C=O
U : Upper
specification
limit
L : Lower
specification
limit
n=22,C=O
n=22 ,C=O
n=22 ,C=O
n=22 ,C=O
n=22,C=O
*l Test method, conforms to JIS C 7021.
*2 Solder shalI adhere at the area of 95% or more of immersed portion of
lead, and pin hole or other holes shall not be concentrated on one portion.
*3 The lead pin depth dipped into solder shall be 0.2mm away from the
root of lead pins.
*4 Terminal bending direction is shown below.
*5 It evaluates after washing by specified solvent in attach sheet- l-l.
n
0.2mm or more
Soldering
area

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