EL1056C View Datasheet(PDF) - Elantec -> Intersil

Part Name

Description

Manufacturer

EL1056C

Monolithic High-Speed Pin Driver

Elantec -> Intersil 

EL1056AC EL1056C

Monolithic High-Speed Pin Driver

Power Down Contd

Supply and Input Bypassing

The Va Ba Vb and Bb leads should be by-

passed very closely with 0 1 mF capacitors pref-

erably chip type There should be a wide ground

plane between bypasses and this can be the heat-

sink copper It is wise to also have a 4 7 mF tanta-

lum bypass capacitor within a couple of inches to

the driver

The logic inputs are active device bases and can

oscillate if presented with inductive lines A local

resistor of 1000X or less to ground will suffice in

de-Q’ing any resonance A 100 pF or larger capac-

itor can also serve as a bypass

Thermal Considerations

The package of the EL1056 includes two fused

leads on each side which are connected to the in-

ternal die mounting metal Heat generated in the

die flows through the mounting pad to the fused

leads and then to the circuit-board copper

achieving a thermal resistance to air around

40 W Characterization curves show the thermal

resistance versus airflow rate Consult the

EL1056 Demonstration Board literature for a

suggested board pattern Note that thicker layers

of copper than we used improves the thermal re-

sistance further to a limit of 22 C W for an ‘‘infi-

nite heatsink’’ directly soldered to the fused

leads

As a practical limit the die temperature should

be kept to 125 C rather than the allowable 150 C

to retain optimum timing accuracies

14

Share Link: