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TDA7263M View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
TDA7263M
ST-Microelectronics
STMicroelectronics ST-Microelectronics
TDA7263M Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
TDA7263M
APPLICATION SUGGESTION
The recommended values of the components are those shown on application circuit of figure 1. Different
values can be used; the following table can help the designer.
Component
Recomm.
Value
Purpose
Larger Than
Smaller Than
R1 and R3
1.5KClose loop gain setting (*) Increase of gain
Decrease of gain
R2 and R4
47
Close loop gain setting (*) Decrease of gain
Increase of gain
R5 and R6
4.7Frequency stability
Danger of oscillations
C1 and C2
100nF Input DC decoupling
Higher SVR
Higher low frequency cutoff
C3
47µF - Ripple Rejection
Increase of the Switch-on - Degradation of SVR
- Mute time constant
time
- Worse turn-off pop by muting
C4
100nF Supply Voltage Bypass
Danger of oscillations
C5
1000µF Supply Voltage Bypass
C6 and C7
47µF
Feedback input DC
decoupling
Increase of the Switch-on Decrease of the Switch-on
time
time
C8 and C9
0.1µF Frequency stability
Danger of oscillations
C10 and C11 1000µF Output DC decoupling
Higher low-frequency cut-off
(*) Closed loop gain must be higher than 26dB
Obsolete Product(s) - Obsolete Product(s) Figure 8: P. C. Board and Component Layout of the Application Circuit (1:1 scale).
BUILT-IN PROTECTION SYSTEMS
THERMAL SHUT-DOWN
circuit. There is no device damage in the case
of excessive junction temperature; all that
happens is that PO (and therefore Ptot) and IO
The presence of a thermal limiting circuit offers
are reduced.
the following advantages:
1-an overload on the output (even if it is perma-
nent), or an excessive ambient temperature
can be easily withstood.
2-the heatsink can have a smaller factor of
safety compared with that of a conventional
SHORT CIRCUIT (AC CONDITIONS)
The TDA7263M can withstand accidental short
circuits across the speaker made by a wrong con-
nection during normal play operation.
5/7

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