AD5551/AD5552
ABSOLUTE MAXIMUM RATINGS*
(TA = 25°C unless otherwise noted)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
Digital Input Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V
VOUT to AGND . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
AGND, AGNDF, AGNDS to DGND . . . . . –0.3 V to +0.3 V
Input Current to Any Pin Except Supplies . . . . . . . . ± 10 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature, (TJ max) . . . . . . . . . 150°C
Package Power Dissipation . . . . . . . . . . . . . (TJ max – TA)/θJA
Thermal Impedance θJA
SOIC (SO-8) . . . . . . . . . . . . . . . . . . . . . . . . . . 149.5°C/W
SOIC (R-14) . . . . . . . . . . . . . . . . . . . . . . . . . . 104.5°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDERING GUIDE
Model
INL
DNL
Temperature Range
AD5551BR
AD5552BR
± 1 LSB
± 1 LSB
± 0.8 LSB –40°C to +85°C
± 0.8 LSB –40°C to +85°C
Die Size = 80 ϫ 139 = 11,120 sq mil; Number of Transistors = 1230.
Package Description
8-Lead Small Outline IC
14-Lead Small Outline IC
Package Option
SO-8
R-14
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD5551/AD5552 features proprietary ESD protection circuitry, permanent damage may occur
on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
Mnemonic
VOUT
AGND
VREF
CS
SCLK
DIN
DGND
VDD
Pin No.
1
2
3
4
5
6
7
8
AD5551 PIN FUNCTION DESCRIPTIONS
Description
Analog Output Voltage from the DAC.
Ground Reference Point for Analog Circuitry.
This is the voltage reference input for the DAC. Connect to external reference ranges from
2 V to VDD.
This is an active low-logic input signal. The chip select signal is used to frame the serial
data input.
Clock Input. Data is clocked into the input register on the rising edge of SCLK. Duty cycle
must be between 40% and 60%.
Serial Data Input. This device accepts 14-bit words. Data is clocked into the input register on
the rising edge of SCLK.
Digital Ground. Ground reference for digital circuitry.
Analog Supply Voltage, 5 V ± 10%.
AD5551 PIN CONFIGURATION
SOIC
VOUT 1
8 VDD
AGND 2 AD5551 7 DGND
TOP VIEW
VREF 3 (Not to Scale) 6 DIN
CS 4
5 SCLK
–4–
AD5552 PIN CONFIGURATION
SOIC
RFB 1
14 VDD
VOUT 2
13 INV
AGNDF
AGNDS
VREFS
3
12 DGND
AD5552
4 TOP VIEW 11 LDAC
5 (Not to Scale) 10 DIN
VREFF 6
CS 7
9 NC
8 SCLK
NC = NO CONNECT
REV. 0