CXG1081TN Просмотр технического описания (PDF) - Sony Semiconductor

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Компоненты Описание

производитель

CXG1081TN

Receiving Dual-Band Mixer

Sony Semiconductor 

Package Outline

Unit: mm

10PIN TSSOP(PLASTIC)

∗2.8 ± 0.1

10

6

1.2MAX

0.1

+ 0.15

0.1 – 0.05

CXG1081TN

1

0.22

5

0.5

0.1 M

0.25

0° to 10°

A

(0.2)

+ 0.08

0.22 – 0.07

DETAIL A

NOTE: “∗” Dimensions do not include mold protrusion.

SONY CODE

EIAJ CODE

JEDEC CODE

TSSOP-10P-L01

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

COPPER ALLOY

PACKAGE MASS

0.02g

–8–

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