NDS8426 Просмотр технического описания (PDF) - Fairchild Semiconductor
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NDS8426 Datasheet PDF : 10 Pages
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Typical Electrical and Thermal Characteristics (continued)
70
VDS = 5V
60
50
TJ= -55°C
25°C
40
125°C
30
20
10
0
0
10
20
30
40
I D, DRAIN CURRENT (A)
Figure 13. Transconductance Variation with Drain
Current and Temperature.
2.5
1a
2
1.5
1b
1c
1
0.5
0
4.5"x5" FR-4 Board
TA = 25o C
Still Air
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in 2 )
Figure 14. SO-8 Maximum Steady-State Power
Dissipation versus Copper Mounting Pad Area.
11
10
1a
9
8
1b
1c
7
6
0
4.5"x5" FR-4 Board
TA = 25 oC
Still Air
VGS = 4.5V
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in2 )
Figure 15. Maximum Steady-State Drain
Current versus Copper Mounting Pad
Area.
50
20 RDS(ON) LIMIT
10
10m1sms
5
2
1
0.5
VGS = 4.5V
0.3
SINGLE PULSE
100ms
1s
10s
DC
RθJA = See Note 1c
0.1
A TA = 25°C
0.05
0.1 0.2
0.5
1
2
5
10
20 30
VDS , DRAIN-SOURCE VOLTAGE (V)
Figure 16. Maximum Safe Operating Area.
1
0 .5
0 .2
0 .1
0 .0 5
0 .0 2
0 .0 1
0 .0 0 5
0 .0 0 2
0 .0 0 1
0.0001
D = 0.5
0.2
0.1
0.05
0.02
0.01
Single Pulse
0 .001
0 .0 1
0 .1
1
t1 , TIME (sec)
R θJA (t) = r(t) * RθJA
R θJA = See Note 1c
P(pk)
t1
t2
TJ - TA = P * R θJA (t)
Duty Cycle, D = t 1 / t 2
10
100
300
Figure 17. Transient Thermal Response Curve.
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
depending on the circuit board design.
NDS8426 Rev.E
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