REVISION HISTORY
REVISION HISTORY
REVISION DATE
9.0
5/2005
10.0
8/2005
11.0
12/2005
12.0
1/2006
13.0
6/2006
14.0
8/2006
15.0
10/2006
16.0
6/2007
DESCRIPTION OF CHANGES
• Converted to Freescale format
• Added A & B Versions
• Updated Device Variation Table, and Note “* Recommended device for all new designs”
• Added EF (Pb-Free) Devices, and higher soldering temperature
• Implemented Revision History page
• Updated Simplified Application Diagrams
• Updated Typical Application Schematic
• Added 33897C and D versions and Timing Diagrams
• Updated Table 4, Static Electrical Characteristics - LOAD and BUS parameters
• Updated Ordering Information.
• Removed “Unless otherwise noted” from Static Electrical Characteristics & Dynamic
Electrical Characteristics table introductions
• Added Part Numbers MC33897TD and MC33897TEF to Ordering Information on Page 1.
• Added 33897T to Table 1, Device Variations on Page 3, Referencing Electrical Changes
per Errata MC33897TER, Revision 3 and specifying ESD variations
• Removed Part Numbers MC33897TD/R2, MC33897TEF/R2, MC33897CLEF/R2, PC33897CLEF/R2,
MC33897DLEF/R2, and PC33897DLEF/R2
• Added Part Numbers MCZ33897EF/R2, MCZ33897TEF/R2, MCZ33897AEF/R2, MCZ33897CEF/R2,
MCZ33897BEF/R2, and MCZ33897DEF/R2 to the Ordering Information block on Page 1.
• Updated Device Variations on page 3 for “T” suffix products
• Split out Human Body Model on page 6 to differentiate between T and non-T versions
• Added Undervoltage Hysteresis on page 7
• Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter
from Maximum Ratings on page 6. Added note with instructions to obtain this information
from www.freescale.com.
• Removed watermark, “Advance Information” from page 1.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33897/A/B/C/D/T
19