MC74LVX259D Просмотр технического описания (PDF) - ON Semiconductor
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MC74LVX259D Datasheet PDF : 11 Pages
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MC74LVX259
EMBOSSED CARRIER DIMENSIONS (See Notes 8. and 9.)
Tape B1
Size Max
D
D1
E
F
K
P
P0
P2
R
T
W
8 mm 4.35 mm
(0.179”)
12 mm 8.2 mm
(0.323”)
1.5 mm
+ 0.1
–0.0
(0.059”
+0.004
–0.0)
1.0 mm
Min
(0.179”)
1.5 mm
Min
(0.060)
1.75 mm
±0.1
(0.069
±0.004”)
3.5 mm
±0.5
(1.38
±0.002”)
5.5 mm
±0.5
(0.217
±0.002”)
2.4 mm
Max
(0.094”)
6.4 mm
Max
(0.252”)
4.0 mm
±0.10
(0.157
±0.004”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
4.0 mm
±0.1
(0.157
±0.004”)
2.0 mm
±0.1
(0.079
±0.004”)
25 mm
(0.98”)
30 mm
(1.18”)
0.6 mm
(0.024)
8.3 mm
(0.327)
12.0 mm
±0.3
(0.470
±0.012”)
16 mm 12.1 mm
(0.476”)
7.5 mm
±0.10
(0.295
±0.004”)
7.9 mm
Max
(0.311”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
12.0 mm
±0.10
(0.472
±0.004”)
16.3 mm
(0.642)
24 mm 20.1 mm
(0.791”)
11.5 mm
±0.10
(0.453
±0.004”)
11.9 mm
Max
(0.468”)
16.0 mm
±0.10
(0.63
±0.004”)
24.3 mm
(0.957)
8. Metric Dimensions Govern–English are in parentheses for reference only.
9. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
0.50 mm max. The component cannot rotate more than 10° within the determined cavity
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8
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